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Failure Modes The silver surface readily shows tarnish from exposure to sulfur and chloride environments. Excessively tarnished parts have limited solderability. As a galvanic process, aggressive silver baths can attack copper circuitry. Attack can occur at the interface with solder mask or at the electroless copper layer on sidewalls. The attack is more severe at high thicknesses over 0.50 mm and if the PCB is reworked with multiple passes through immersion silver. Copper attack can result in electrical opens. Aggressive silver baths, when deposited on rough copper, can also attack on pad surfaces, causing caves in the copper. Studies show that caves can result in layers of very small voids at the copper-solder interface after soldering. These structures, termed microvoids, can dramatically reduce solderjoint strength and produce electrical opens. Each of the preceding failure modes is worsened when the silver bath plates nonuniformly. The chemicals need to be formulated and operated in such a way to provide uniform galvanic exchange metal deposition.

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Immersion tin is a thin coating of pure tin, typically 0.6 to 1.2 mm thick, which protects the underlying copper from oxidation and provides a highly solderable surface.Tin is deposited using a galvanic displacement process and can be applied in vertical or conveyorized equipment.Tin boards are used primarily for solderability and have very good compliant pin connector functionality.

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Tin readily forms an intermetallic with copper, so tin can pose challenges with shelf-life, multiple soldering operations, and contact functions. Tin is also restricted in some regions due to environmental concerns over the use of the bath ingredient thiourea. 32.7.1 Chemical Coating As with all immersion metal systems, the copper needs to be perfectly clean and textured before the tin plating step.A predip is used to maintain proper chemical balance in the tin bath and prevent contamination. The tin deposition is not a direct galvanic displacement, since tin is more electronegative than copper.Thiourea is used in tin chemical formulation to create a copper-thiourea complex on the surface.This complex becomes more electronegative than tin, and then participates in the immersion reaction. Because of the need to drive the reaction, the tin bath contains relatively high concentrations of chemicals, which must be thoroughly rinsed. Waste treatment of the system is complicated due to high levels of thiourea. 32.7.2 Fabrication Process Table 32.9 shows the fabrication process for the immersion tin surface process, including chemicals used and dwell times.

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TABLE 32.9 Process Flow for Immersion Tin Process Cleaner Microetch Predip Tin Postdip (optional) Chemicals Aqueous solvents, detergents, and emulsifiers. Acid can help undercut residues and remove thick copper oxides. 1 2 mm of Cu is oxidized to Cu++ and dissolved. Normally, the ingredients of the tin bath without the tin metal itself. Tin, thiourea, acids, whisker inhibiting trace metals, chelation. Can be an extra cleaner for demanding ionic cleanliness applications. Time (min.) 1 4 0.5 1.0 1.0 4.0 12.0

Symbol and grade Over 1 Up to 3 With large D10 +60 min clearance +20 With medium E7 +24 minimum +14 clearance E8 +28 +14 With small F7 +16 minimum +6 clearance F8 +20 +6 With smallest G7 +12 min clearance +2 H6 +6 0 H7 +10 0 H8 +14 0 H9 +25 0 H11 +60 0 J6 +2 4 J7 +4 6 K6 0 6 K7 0 10 Secure M6 2 against 8 turning M7 2 12 N6 4 10 N7 4 14 Interference P7 6 fit-holes 16 P9 6 31 h5 0 4 h6 0 6 Basic shaft h8 0 14 h9 0 25 h11 0 60

Few production installations use immersion tin in horizontal conveyorized applications due to the chemical process time and the higher temperatures used. Conveyorized lines are long and therefore expensive. The use of vertical tanks carrying baskets of panels for immersion tin plating makes better use of production floor space. Due to the high sulfur reactivity of the thiourea ingredient, tin lines should be dedicated to the tin process only and not mixed in with OSP, silver, or ENIG lines where sulfur can harm the surfaces. 32.7.3 Advantages and Disadvantages Table 32.10 compares the advantages and disadvantages of immersion tin used as a surface finish.

TABLE 32.10 Advantages and Disadvantages of Immersion Tin Surface Finish Tin Advantages Flat; fine-pitch assembly Inexpensive finish No Pb Cu/Sn solderjoint Excellent compliant pin functionality Less visible tarnish Reworkable Tin Disadvantages Handling-sensitive Use of thiourea (a carcinogen) Exposed tin on final assembly can corrode Whiskers Degradation with time/ heat and multiple reflow soldering Solder mask attack Difficult thickness measurement

Other surface finishes include reflowed tin-lead, electrolytic nickel/electrolytic gold, antitarnish and reflux, electroless palladium, electroless gold, direct immersion gold, and solid solder deposit.

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